China’s securities regulator said on July 7 that expansion of the innovation and entrepreneurship bond pilot for facilitating financing of high-tech small and medium-sized companies will continue.

Gao Li, spokeswoman of the China Securities Regulatory Commission, said innovation and entrepreneurship bonds will be added to the local government financial support system and the commission will set up a fast track for the examination and approval of their issuing.

In April, China Securities Regulatory Commission sought out public advice for the draft of the guideline regarding the innovation and entrepreneurship bond pilot. Companies registered at national innovation and entrepreneurship parks and those listed at the innovation market of New Third Board can participate in the pilot program.